Dimensity 7000 features an 8-core CPU consisting of four Cortex-A78 cores clocked at 2.75 GHz and four other cortex-A55 cores clocked at 2.0GHz. From the looks of it all, this SoC shapes it into an excellent rounder, perfect for that mid-range phone range.

Those familiar with the mobile chip industry may realize that the CPU dimension 7000 is exactly the same as the Dimensity 1200. -1 + 3 (one Cortex-A78 at 3.0GHz, and three at 2.6GHz).

As for the photographic side, the Dimensity 7000 comes with the Mali-G510 MC6 GPU, which was announced by ARM in early 2021. The balance between performance and efficiency continues here, ARM claims that the Mali-G510 MC6 beats that area completely. .

The beginning of 2022 is when we expect to see the Dimesnity 7000 chip in action when other mid-range phones start appearing on the market. I hope it will look good as it sounds in the paper.

Samsung announced three new chipsets which are compliant with the 3GPP Release 16. The three new chipsets announced are – a) 3rd generation mmWave RFIC, b) 2nd generation 5G Modem SoC, and c) DFE-RFIC Integrated chip.

The 1st chip that Samsung announced at the event was ‘3rd generation mmWave RFIC’. This 3rd generation chipset can support frequencies in both 28 GHz and 39 GHz spectrum bands and will be embedded in Samsung’s next-generation 5G Compact Macro. In this the chipset comes with, the antenna size could be reduced by 50%, resulting in more space inside the 5G radio. also, the new RFIC chipset increases power efficiency making the 5G radio lightweight. alongwith the power output of the chipset has increased.

The 2nd chipset that Samsung announced was the ‘2nd generation 5G Modem SoC’. This new chipset from Samsung will enable the forthcoming baseband unit to get two times the capacity and also reduce the power consumption by each cell by 50%. It will support frequencies both in the mmWave and sub-6 GHz spectrum bands. Also, the chipset also offers better power efficiency and beam-forming for Samsung’s next-generation 5G compact Macro and Massive MIMO radio.

The 3rd chipset announced by Samsung was the ‘DFE-RFIC Integrated chip’. This new chip combines both DFE and RFIC functions for mmWave and sub-6 GHz. With these integrated functions, the frequency bandwidth is doubled. At the same time, the chipset will allow the next generation solutions to come in reduced sizes and also be more powerful.